淡江大學機構典藏:Item 987654321/55084
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    Please use this identifier to cite or link to this item: https://tkuir.lib.tku.edu.tw/dspace/handle/987654321/55084


    Title: Time Domain Microwave Imaging for a Buried Dielectric Cylinder by Dynamic Differential Evolution
    Authors: Li, Ching-Lieh;Chien, Wei;Huang, Chung-Hsin;Chiu, Chien-Ching
    Contributors: 淡江大學電機工程學系
    Keywords: Time domain inverse scattering;FDTD;Subgridding;Dynamic differential evolution;Homogenous dielectric cylinder
    Date: 2010
    Issue Date: 2011-08-10 20:12:49 (UTC+8)
    Publisher: Amsterdam: I O S Press
    Abstract: This paper presents the studies of time domain inverse scattering for a two dimensional homogeneous dielectric cylinder buried in a half-space which are based on the finite difference time domain (FDTD) method and the dynamic differential evolution (DDE). For the forward scattering, the FDTD method is employed to calculate the scattered E fields, while for the inverse scattering the DDE scheme is utilized to determine the shape, location and the permittivity of the buried cylindrical scatterer with arbitrary cross section. The subgirdding technique is implemented for the FDTD code in order to model the shape of the cylinder more smoothly. In additions, in order to describe an unknown cylinder with arbitrary cross section more effectively during the course of searching, the closed cubic-spline expansion is adopted to represent the scatterer contour instead of the frequently used trigonometric series. Numerical results demonstrate that, even when the initial guess is far away from the exact one, good reconstruction can be obtained. In addition, the effects of Gaussian noise on the reconstruction results are investigated. Numerical results show that even the measured scattered fields are contaminated with Gaussian noise, DDE is able to yield good reconstructed quality.
    Relation: International Journal of Applied Electromagnetics and Mechanics 34(1-2), pp.73-86
    DOI: 10.3233/JAE-2010-1088
    Appears in Collections:[Graduate Institute & Department of Electrical Engineering] Journal Article

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