| Abstract: | 本研究分為三個部份來探討：第一個部份選用4,4-亞甲基-2,6-二乙基苯胺(4,4-methylenebis-2,6-diethylaniline, TEMDA)、4,6-二胺基-2-巰基嘧啶(4,6-diam- ino-2-mercaptopyrimidine hydrate, DAMP)以及二苯酮四酸二酐(3,3’,4,4’-benzo- phenone-tetracarboxylic dianhydride, BTDA)利用縮合反應來製備感光性聚亞醯胺，將感光性聚亞醯胺經微影製程形成圖案，分別利用SEM和第二部份選用兩種不同方法來製備奈米金粒子吸附在感光性聚亞醯胺薄膜表面上：(1)感光性聚亞醯胺薄膜先進行微影製程再浸泡奈米金；(2)感光性聚亞醯胺薄膜先浸泡奈米金再進行微影製程。感光性聚亞醯胺-奈米金粒子層的圖案利用SEM、EDAX和a-step來分析。方法(1)顯示出奈米金粒子均勻分散在圖案上，而方法(2)顯示出未曝光的感光性聚亞醯胺沒有顯影完全，奈米金粒子分散在曝光與未曝光區域。
第三部份利用聚亞醯胺與奈米金經由逐層組合來製備多層複合薄膜。薄膜的每步驟的製備經由SEM可確認。並且觀察到奈米金粒子均勻分散在聚亞醯胺層的表面上。
This research was divided into three parts. In the first part, the photosensitive polyimide (PSPI) thin film was prepared based on 4,4-methylenebis-2,6-diethylaniline (TEMDA), 4,6-diamino-2-mercaptopyrimidine hydrate (DAMP), add 3,3’,4,4’-benzo- phenone-tetracarboxylic dianhydride (BTDA). The PSPI was patterned by lithography, and the patterns were observed by SEM and , respectively.
In the second part, the gold nanoparticles (GNPs) adsorbed on the PSPI were conducted, Two different lithography processes were used: (1) The PSPI thin films were patterned by lithography, and then the GNPs were adsorbed on the patterns; (2) The GNPs were adsorbed on the PSPI thin films, and then the PSPI thin films were pattered by lithography. The patterns of the PSPI/Au composite thin films were characterized by SEM, EDAX, and a-step. The samples of the process (1) showed that the GNPs well dispersed on the patterns. However, the samples of process (2) showed that the unexposured PSPI were not removed completely. The GNPs were dispersed on the exposured and unexposured domains.
In the third part, a composite thin film consisting of polyimide and GNPs was fabricated through layer-by-layer assembly. The stepwise growth of the films was confirmed by SEM, and GNPs were observed and well dispersed on the surface of the polyimide layer. |
