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    Please use this identifier to cite or link to this item: http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/53869

    Title: 半導體晶圓之磨料加工方法
    Authors: 陳炤彰;劉偉均;簡志偉;徐振貴
    Contributors: 淡江大學機械與機電工程學系
    Date: 2001-09-11
    Issue Date: 2011-05-20 15:36:54 (UTC+8)
    Abstract: 本案為一種半導體晶圓之磨料加工方法,係於一半導體研磨機具中進行下列步驟:置一晶圓於該半導體研磨機具中;以及使該半導體研磨機具產生一碎形路徑之相對運動,對該晶圓進行一研磨動作。
    Appears in Collections:[機械與機電工程學系暨研究所] 專利

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