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    Please use this identifier to cite or link to this item: http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/53866

    Title: Thermal-chemical polishing devices and method thereof
    Authors: 趙崇禮;Chao, Choung-lii;Ma, Kung-jeng;Lin, Hung-yi
    Contributors: 淡江大學機械與機電工程學系
    Date: 2003-05-27
    Issue Date: 2011-05-20 15:36:46 (UTC+8)
    Abstract: A thermal-chemical polishing device and method for polishing a diamond film of a workpiece, the device includes a horizontally displaced first rotatable high rpm shaft and a vertically displaced second rotatable high rpm shaft that are perpendicular. The first shaft is made of a material from transition metals or rare-earth elements which undergo a chemical reaction with the diamond film at high temperature. The circumferential surface of the first shaft has a predefined heating region. The second shaft moves axially towards the first shaft to allow the diamond film to make contact with the heating region of the first shaft. A heating unit is provided to heat up the heating region to create a chemical reaction for thermal-chemical polishing to perform while the diamond film is in contact with the heating region. The device of the present invention increases the rate of polishing and also decreases cost.
    Appears in Collections:[Graduate Institute & Department of Mechanical and Electro-Mechanical Engineering] Patent

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