淡江大學機構典藏:Item 987654321/53861
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    Please use this identifier to cite or link to this item: https://tkuir.lib.tku.edu.tw/dspace/handle/987654321/53861


    Title: Hot embossing auto-leveling apparatus and method
    Authors: 趙崇禮;Chao, Choung-lii;Huang;Jung-yan;Tsai, Chu-shu;Mu, Chuan-kang;Yang, Jauh-jung;Huang, Cheng-chun;Liu, Ming-yueh
    Contributors: 淡江大學機械與機電工程學系
    Date: 2003-03-20
    Issue Date: 2011-05-20 15:36:31 (UTC+8)
    Abstract: A hot embossing auto-leveling apparatus which has an air-floating spherical bearing between a lower mold and a base, placed in a depression on the base, with the base housing an air inlet and an air outlet. A hot embossing auto-leveling method, comprising the steps of (1) performing an upward and downward coupling movement of the lower and upper molds; (2) adjusting the lower mold against the upper mold using the air-floating spherical bearing; (3) fixing the lower mold by under pressure in an orientation parallel to the upper mold; (4) placing a molded part on the lower mold; (5) evacuating, heating and pressurizing a working chamber; (6) cooling; and (7) opening.
    Appears in Collections:[Graduate Institute & Department of Mechanical and Electro-Mechanical Engineering] Patent

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