High power LED lighting assembly incorporated with a heat dissipation module with heat pipe

淡江大學機構典藏 > 工學院 > 機械與機電工程學系暨研究所 > 專利 > Item 987654321/53860

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題名:	High power LED lighting assembly incorporated with a heat dissipation module with heat pipe
其他題名:	高功率發光二極體照明燈具與其散熱模組
作者:	康尚文;Kang, Shung-wen;Tsai, Meng-chang;簡坤誠;Chien, Kun-cheng
貢獻者:	淡江大學機械與機電工程學系
日期:	2007-04-11
上傳時間:	2011-05-20 15:36:28 (UTC+8)
摘要:	A high power light emitting diode (LED) lighting assembly incorporated with heat dissipation module is provided. The LED lighting assembly includes a heat exchange base, at least one LED array, at least one heat pipe and a heat dissipation module. The heat exchange base includes at least one LED configuration plan for mounting of the LED array and at least a hollow part for insertion of the heat pipe. The LED array is arranged at a predetermined projecting angle at the LED configuration plane. The heat pipe includes a heated section, a cooling section and a conducting section, and contains a working fluid therein. The heat exchange base is mounted to the heated section and the heat dissipation module is mounted to the cooling section. The thermal energy generated by the LEDs is conducted from the heat exchange base to the heated section of the heat pipe, whereby allowing the working fluid in the heat pipe to be heated and vaporized, and flows, from the conducting section to the cooling section for dissipation at the heat dissipation module.
顯示於類別:	[機械與機電工程學系暨研究所] 專利

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