以高熱膨脹係數聚合材料製成之熱挫曲式微致動單元

機構典藏 > College of Engineering > Graduate Institute & Department of Mechanical and Electro-Mechanical Engineering > Patent > Item 987654321/53856

Please use this identifier to cite or link to this item: https://tkuir.lib.tku.edu.tw/dspace/handle/987654321/53856

Title:	以高熱膨脹係數聚合材料製成之熱挫曲式微致動單元
Authors:	楊龍杰
Contributors:	淡江大學機械與機電工程學系
Date:	2008-03-01
Issue Date:	2011-05-20 15:36:05 (UTC+8)
Abstract:	一種以高熱膨脹係數聚合材料聚對二甲苯熱挫曲式微致動單元，用以將來源液體區之液體傳輸至目標液體區，係在基材本體上建構有熱挫曲式微致動單元，該熱挫曲式微致動單元係包含有以一種高熱膨脹係數之聚合材料所製成之下層薄膜與上層薄膜、建構於兩薄膜間之金屬電阻、以及在該下層薄膜與該基材本體間圍構之流道。當供應電力至該金屬電阻時，藉由該金屬電阻所產生之熱能使不同厚度之上層薄膜與下層薄膜因溫差而產生熱挫曲變形，而將該來源液體區之液體經由流道傳輸至該目標液體區。
Appears in Collections:	[Graduate Institute & Department of Mechanical and Electro-Mechanical Engineering] Patent

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