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    Please use this identifier to cite or link to this item: http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/53854

    Title: 壓阻式壓力感測器及其封裝方法
    Other Titles: A piezo-resistive pressure sensor and its packaging method
    Authors: 楊龍杰
    Contributors: 淡江大學機械與機電工程學系
    Date: 2006-07-21
    Issue Date: 2011-05-20 15:36:00 (UTC+8)
    Abstract: 本發明係有關於一種壓阻式壓力感測器(piezo-resistive pressure sensor)以及應用於壓阻式壓力感測器之新型晶片等級封裝方式(wafer level package)。本發明主要是利用高分子矽膠材料「聚二甲基矽氧烷」(polydimethylsiloxane, PDMS),取代Pyrex #7740,作為壓力感測器壓力薄膜下方空腔結構(pressure cavity) 的密封材。本發明利用聚二甲基矽氧烷的成本低廉、製程快速與低溫製程之特性,具有降低壓力計製造成本、縮短封裝時間、提高感測器性能等優點。
    Appears in Collections:[機械與機電工程學系暨研究所] 專利

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