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    Please use this identifier to cite or link to this item: https://tkuir.lib.tku.edu.tw/dspace/handle/987654321/53837

    Title: 防電磁波干擾積層式鋁填充塑膠粒及板之製造方法及裝置(二)
    Authors: 莊東漢;林清彬;張錦泉;蔡騰群
    Contributors: 淡江大學機械與機電工程學系
    Date: 1998-01-01
    Issue Date: 2011-05-20 15:35:10 (UTC+8)
    Abstract: 本發明揭示一種創新改良的防電磁波干擾積層式鋁填充塑膠粒製程方法,利用1至10捲鋁箔經塗佈偶合劑、烘乾再由一組2至11個具長條狹縫形押出口之押出模具於各層鋁箔間均勻擠入熔融塑膠,再經3道特殊設計熱軋滾輪分別進行集束、壓薄及定形成連續之積層排列塑膠與鋁箔複合板,經水冷卻後以短碎或裁剪方式製成寬度0.7至2mm,長度5至10mm,厚度0.1至2mm之長條形積層式鋁填式塑膠粒。利用此種創新的鋁填充塑膠粒射出成型各種防電磁波干擾塑膠製品,只須要低於10%之鋁填充量即可達到優異之電磁屏蔽效果。
    Appears in Collections:[機械與機電工程學系暨研究所] 專利

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