English  |  正體中文  |  简体中文  |  全文筆數/總筆數 : 62570/95241 (66%)
造訪人次 : 2568523      線上人數 : 83
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library & TKU Library IR team.
搜尋範圍 查詢小技巧:
  • 您可在西文檢索詞彙前後加上"雙引號",以獲取較精準的檢索結果
  • 若欲以作者姓名搜尋,建議至進階搜尋限定作者欄位,可獲得較完整資料
  • 進階搜尋
    請使用永久網址來引用或連結此文件: https://tkuir.lib.tku.edu.tw/dspace/handle/987654321/53719

    題名: Porous structure and thermal stability of photosensitive silica/polyimide composites prepared by sol-gel process
    作者: Huang, Shu-Hui;Don, Trong-Ming;Lai, Wei-Chi;Chen, Ching-Chung;Cheng, Liao-Ping
    貢獻者: 淡江大學化學工程與材料工程學系
    關鍵詞: composites;dielectric properties;silicas;polyimides;morphology
    日期: 2009-11
    上傳時間: 2011-05-20 09:56:45 (UTC+8)
    出版者: Hoboken: John Wiley & Sons, Inc.
    摘要: The sol-gel method was employed to synthesize an inorganic–organic photosensitive composite material, silica/polyimide. Silica was covalently bonded to polyimide by introduction of 1,4-aminophenol as a coupling agent. A photosensitive cross-linking agent, 2-(dimethylamino) ethyl methacrylate, was used to engender UV sensitivity to the composite. Using field emission scanning electron microscope imaging at very high magnifications, the composite film was found to exhibit a porous cross-sectional structure. The pores were interconnected to form numerous continuous channels within the matrix and silica particles were attached to the pore wall of the polyimide host. Depending on the preparation conditions, the size of the silica particles could vary from 20 nm to a few μm. The thermal degradation temperatures, dynamic mechanical properties, glass transition temperatures, thermal expansion coefficients, and dielectric constants of various silica/polyimide composites were measured, and the results indicated that incorporation of silica could improve the thermal and dimensional stabilities of the polyimide. Also, because the silica/polyimide composite had a porous interior structure, it had a rather low dielectric constant with the lowest achievable value being 1.82.
    關聯: Journal of Applied Polymer Science 114(4), pp.2019-2029
    DOI: 10.1002/app.30790
    顯示於類別:[化學工程與材料工程學系暨研究所] 期刊論文


    檔案 大小格式瀏覽次數
    1097-4628_114(4)_p2019-2029.pdf1116KbAdobe PDF265檢視/開啟



    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library & TKU Library IR teams. Copyright ©   - 回饋