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    Please use this identifier to cite or link to this item: https://tkuir.lib.tku.edu.tw/dspace/handle/987654321/52815

    Title: Noise Mitigation Capability Comparison: Power Bus Isolation vs. Power Plane Segmentation
    Authors: Chou, Yun-Hsih;Jeng, Ming-Jer;Tsai, Ming-Chang;Lee, Yang-Han;Jan, Yih-Guang
    Contributors: 淡江大學電機工程學系
    Keywords: Power Bus Noise;Decoupling Capacitor;Power Isolation Island
    Date: 2010-06-01
    Issue Date: 2010-12-01 10:34:58 (UTC+8)
    Publisher: 臺北縣:淡江大學
    Abstract: In the printed circuit board design it usually implements two methods to solve the power-bus noise interference problem. One is by adding decoupling capacitor and the other method is to adopt power bus isolation or power plane segmentation. Large isolation gap distance gets better isolation impedance and it consequently improves the high frequency power-bus noise elimination capability. Meanwhile another important factor needed to consider is the segmentation pattern, the implementation cost will determine the segmentation size of the isolation area. Unavoidable interference exists in the digital and analog circuits that using the common power source. In this paper we will search and discuss several commonly implemented isolation techniques and study how to reduce the interference effect. By using isolated power island will apparently reduce board's impedance and the location of the power island will affect the board's resonant structure. The bridge width of the connecting bridge appreciably affects on the first resonant location, the segmentation gap size affects the coupling amount. The larger the gap size the smaller the gap capacitance will be and consequently larger gap size will improve the noise isolation capability; different gap shapes will affect the board's resonant structure, better board's resonant structure will improve resonant probabilities and consequently increase the board impedance.
    Relation: 淡江理工學刊=Tamkang Journal of Science and Engineering 13(2),頁181-188
    DOI: 10.6180/jase.2010.13.2.08
    Appears in Collections:[Graduate Institute & Department of Electrical Engineering] Journal Article

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