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    Please use this identifier to cite or link to this item: http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/52799


    Title: Thermal Performance of a Loop Thermosyphon
    Authors: Kang, Shung-wen;Tsai, Meng-chang;Hsieh, Chih-sheng;Chen, Jian-you
    Contributors: 淡江大學機械與機電工程學系
    Keywords: Loop Thermosyphon;Enhanced Boiling;Copper Sinter
    Date: 2010-09-01
    Issue Date: 2010-12-01 10:32:35 (UTC+8)
    Publisher: 臺北縣:淡江大學
    Abstract: Experimental investigations were performed on a loop thermosyphon, consisting of a condensation section and an evaporation section. The evaporator chamber used in this study has an inside diameter of 25 mmand a height of 25 mm. Three evaporators, without wick structure and with 1 mmand 4 mmthickness wick structures were examined in the test. The experiments were conducted under the condition of 20 C, 30 C, 40 C and 50 C cooling water, for heating powers from 20 to 250 W, working fluid fill ratios of 5%, 10%, 20%, 30%, 40% and 50%. The experiments used methanol and water as the working fluid. When the system reached the steady state, the temperature was recorded in order to evaluate the performance of the thermosyphon. Effect of cooling water temperatures, fluid fill ratio and evaporator type were studied. Finally, the results show that the wick structure can enhance the heat transfer effects directly. The working fluid water can support a large heating range.
    Relation: 淡江理工學刊=Tamkang Journal of Science and Engineering 13(3),頁281-288
    DOI: 10.6180/jase.2010.13.3.07
    Appears in Collections:[機械與機電工程學系暨研究所] 期刊論文

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