淡江大學機構典藏:Item 987654321/52786
English  |  正體中文  |  简体中文  |  全文笔数/总笔数 : 62805/95882 (66%)
造访人次 : 3993058      在线人数 : 304
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library & TKU Library IR team.
搜寻范围 查询小技巧：
  • 您可在西文检索词汇前后加上"双引号"，以获取较精准的检索结果
  • 若欲以作者姓名搜寻，建议至进阶搜寻限定作者字段，可获得较完整数据
    •  进阶搜寻


    jsp.display-item.identifier=請使用永久網址來引用或連結此文件: https://tkuir.lib.tku.edu.tw/dspace/handle/987654321/52786


    题名: The manufacture and test of (110) orientated silicon based micro heat exchanger
    作者: 康尚文;Kang, Shung-wen;張廣祥;Chang, Guang-shang;Chen, Yu-Tang
    贡献者: 淡江大學機械與機電工程學系
    关键词: Micro cross-flow heat exchanger;Bulk micromachining;Heat transfer area;Pressure drop;Heat transfer coefficient
    日期: 2002-09
    上传时间: 2010-12-01 10:30:44 (UTC+8)
    出版者: 臺北縣：淡江大學
    摘要: The micro cross-flow heat exchanger made of (110)-orientated silicon is fabricated by bulk micromachining that is compatible with semiconductor producing processes, and wafers with hundreds of high aspect ratio channels are bonded together by diffusion bonding with aluminum as medium layers.
    The core of the micro heat exchanger is about 0.918 cm3, and the density of the heat transfer area is 15,294 m2/m3. Using pure water as the working fluid, the Reynolds Numbers show that the fluid field is always laminar flow, and as the maximum pressure drop reaches 2.47 bar, the flow rate is greater than 4.5 L/min. The heat transfer measured between hot and cold fluid is 5 kW; the log mean temperature is greater than 30 K, and that makes the overall heat transfer coefficient up to 24.7 kW/m2-K, corresponds to a volumetric heat transfer coefficient of 188.5 MW/m3-K.
    Except reacted on a few special chemicals, silicon has excellent properties in mechanics, heat transfer, and anti-corrosion, so the (110) silicon based micro heat exchanger suits for the operations at high temperature or in corrosive fluids. The extremely small heat sink appears to have a variety of current and potential applications in areas such as micro-electronic cooling and biomedical processes where high heat transfer power are required with little weight and small volume.
    The micro cross-flow heat exchanger made of (110)-orientated silicon is fabricated by bulk micromachining that is compatible with semiconductor producing processes, and wafers with hundreds of high aspect ratio channels are bonded together by diffusion bonding with aluminum as medium layers. The core of the micro heat exchanger is about 0.918 cm3, and the density of the heat transfer area is 15,294 m2/m3. Using pure water as the working fluid, the Reynolds Numbers show that the fluid field is always laminar flow, and as the maximum pressure drop reaches 2.47 bar, the flow rate is greater than 4.5 L/min. The heat transfer measured between hot and cold fluid is 5 kW; the log mean temperature is greater than 30 K, and that makes the overall heat transfer coefficient up to 24.7 kW/m2-K, corresponds to a volumetric heat transfer coefficient of 188.5 MW/m3-K. Except reacted on a few special chemicals, silicon has excellent properties in mechanics, heat transfer, and anti-corrosion, so the (110) silicon based micro heat exchanger suits for the operations at high temperature or in corrosive fluids. The extremely small heat sink appears to have a variety of current and potential applications in areas such as micro-electronic cooling and biomedical processes where high heat transfer power are required with little weight and small volume.
    關聯: 淡江理工學刊=Tamkang journal of science and engineering 5(3)，頁129-136
    显示于类别:[機械與機電工程學系暨研究所] 期刊論文

    文件中的档案:

    档案 描述 大小格式浏览次数
    1560-6686_5-3-2.pdf387KbUnknown386检视/开启
    index.html0KbHTML24检视/开启

    在機構典藏中所有的数据项都受到原著作权保护.

    TAIR相关文章

    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library & TKU Library IR teams. Copyright ©   - 回馈