淡江大學機構典藏:Item 987654321/52785
English  |  正體中文  |  简体中文  |  全文笔数/总笔数 : 64188/96967 (66%)
造访人次 : 11337262      在线人数 : 43
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library & TKU Library IR team.
搜寻范围 查询小技巧：
  • 您可在西文检索词汇前后加上"双引号"，以获取较精准的检索结果
  • 若欲以作者姓名搜寻，建议至进阶搜寻限定作者字段，可获得较完整数据
    •  进阶搜寻


    jsp.display-item.identifier=請使用永久網址來引用或連結此文件: https://tkuir.lib.tku.edu.tw/dspace/handle/987654321/52785


    题名: Micro Fuse Fabrication and Testing
    作者: 康尚文;Kang, Shung-wen;Chen, Yu-tang;許欽淳;Hsu, Chin-chun;林俊偉;Lin, Jun-wei
    贡献者: 淡江大學機械與機電工程學系
    关键词: Micro copper fuse;Wet etching;Glass epoxy plate;Temperature distribution;Blowing current;Safety standard
    日期: 2007-06
    上传时间: 2010-12-01 10:30:36 (UTC+8)
    出版者: 臺北縣：淡江大學
    摘要: This paper presents a micro copper fuse developed on a glass epoxy plate using wet etching technology. The fuse structure has a length of 600 m and a width of 80 m. The thickness of the copper layer is 30 m. Numerical simulation was studied with ANSYS software to predict the temperature distribution of the micro fuse with variable input current. Different micro fuse cross sectional areas were obtained by controlling the etching time. The fuse characteristics were evaluated experimentally using input power to the blowing current at 0.1 A increment.
    Measured temperature showed good agreement with the simulation data. Under safety standard test requirement, the normal rated current of the design micro fuses are 1.15 A, 1.60 A and 2.10 A at an input voltage of 3.6 V.
    關聯: 淡江理工學刊=Tamkang journal of science and engineering 10(2)，頁173-176
    显示于类别:[機械與機電工程學系暨研究所] 期刊論文

    文件中的档案:

    档案 描述 大小格式浏览次数
    1560-6686_10-2-15.pdf178KbAdobe PDF684检视/开启
    index.html0KbHTML77检视/开启

    在機構典藏中所有的数据项都受到原著作权保护.

    TAIR相关文章

    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library & TKU Library IR teams. Copyright ©   - 回馈