This paper presents a micro copper fuse developed on a glass epoxy plate using wet etching technology. The fuse structure has a length of 600 m and a width of 80 m. The thickness of the copper layer is 30 m. Numerical simulation was studied with ANSYS software to predict the temperature distribution of the micro fuse with variable input current. Different micro fuse cross sectional areas were obtained by controlling the etching time. The fuse characteristics were evaluated experimentally using input power to the blowing current at 0.1 A increment.
Measured temperature showed good agreement with the simulation data. Under safety standard test requirement, the normal rated current of the design micro fuses are 1.15 A, 1.60 A and 2.10 A at an input voltage of 3.6 V.
Relation:
淡江理工學刊=Tamkang journal of science and engineering 10(2)，頁173-176
