Reducing exposed copper on annular rings in a PCB factory through implementation of a Six Sigma project

淡江大學機構典藏 > 商管學院 > 管理科學學系暨研究所 > 期刊論文 > Item 987654321/50712

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題名:	Reducing exposed copper on annular rings in a PCB factory through implementation of a Six Sigma project
作者:	Lee, Kuo-liang;Wei, Chun-chin;李旭華;Lee, Hsu-hua
貢獻者:	淡江大學經營決策學系
關鍵詞:	Six Sigma;DMAIC;project management;PCB
日期:	2009-08-01
上傳時間:	2010-08-10 15:21:38 (UTC+8)
出版者:	Taylor & Francis
摘要:	As a well-structured methodology, Six Sigma enhances product quality by analysing data using statistical approaches to identify root causes of problems and implement effective control plans. This study presents a Six Sigma project at a printing circuit board (PCB) company illustrating how a Six Sigma project and statistical methods have been applied. The defect of exposed copper on annular rings during the developing process was examined. By using qualitative and quantitative tools in the define, measure, analyse, improve and control (DMAIC) methodology, the critical outputs, key point inputs and root causes were identified, analysed and verified. Additionally, a number of temporary and long-term control plans were developed to sustain and enhance the performance of the developing process. Finally, the benefits, experience, and extensions of the Six Sigma project were discussed.
關聯:	Total Quality Management & Business Excellence 20(8), pp.863-876
DOI:	10.1080/14783360903128322
顯示於類別:	[管理科學學系暨研究所] 期刊論文

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