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https://tkuir.lib.tku.edu.tw/dspace/handle/987654321/50712
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| 題名: | Reducing exposed copper on annular rings in a PCB factory through implementation of a Six Sigma project |
| 作者: | Lee, Kuo-liang;Wei, Chun-chin;李旭華;Lee, Hsu-hua |
| 貢獻者: | 淡江大學經營決策學系 |
| 關鍵詞: | Six Sigma;DMAIC;project management;PCB |
| 日期: | 2009-08-01 |
| 上傳時間: | 2010-08-10 15:21:38 (UTC+8) |
| 出版者: | Taylor & Francis |
| 摘要: | As a well-structured methodology, Six Sigma enhances product quality by analysing data using statistical approaches to identify root causes of problems and implement effective control plans. This study presents a Six Sigma project at a printing circuit board (PCB) company illustrating how a Six Sigma project and statistical methods have been applied. The defect of exposed copper on annular rings during the developing process was examined. By using qualitative and quantitative tools in the define, measure, analyse, improve and control (DMAIC) methodology, the critical outputs, key point inputs and root causes were identified, analysed and verified. Additionally, a number of temporary and long-term control plans were developed to sustain and enhance the performance of the developing process. Finally, the benefits, experience, and extensions of the Six Sigma project were discussed. |
| 關聯: | Total Quality Management & Business Excellence 20(8), pp.863-876 |
| DOI: | 10.1080/14783360903128322 |
| 顯示於類別: | [管理科學學系暨研究所] 期刊論文
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