English  |  正體中文  |  简体中文  |  Items with full text/Total items : 62805/95882 (66%)
Visitors : 3907836      Online Users : 584
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library & TKU Library IR team.
Scope Tips:
  • please add "double quotation mark" for query phrases to get precise results
  • please goto advance search for comprehansive author search
  • Adv. Search
    HomeLoginUploadHelpAboutAdminister Goto mobile version
    Please use this identifier to cite or link to this item: https://tkuir.lib.tku.edu.tw/dspace/handle/987654321/50475


    Title: Preparation and properties of Nano-silica Modified Negative Acrylate Photoresist
    Authors: Lee, Chih-kang;Don, Trong-ming;Lai, Wei-chi;Chen, Chin-chung;Lin, Dar-jong;Cheng, Liao-ping
    Contributors: 淡江大學化學工程與材料工程學系
    Keywords: Photoresist;Binder;Sol–gel method;Organic–inorganic nanohybrid
    Date: 2008-10
    Issue Date: 2010-08-09 18:02:39 (UTC+8)
    Publisher: Lausanne: Elsevier S.A.
    Abstract: A series of silica modified photoresists had been successfully developed through incorporation of a particular nanoparticles suspension. Free radical polymerization was employed to synthesize the binder, an acrylate copolymer resin of benzyl methacrylate, methacrylic acid and 2-hydroxyethyl methacrylate, of the photoresist. The acid value, viscosity, molecular weight and thermal properties of the formed binders were measured. Then, surface-modified silica particles prepared by the sol–gel method were introduced to the photoresist. Because the modified silica particles contained considerable amount of reactive double bonds (CC) on their surfaces, they would react with the polyfunctional monomers in the photoresist to form an organic–inorganic nanohybrid. Fourier transform infrared spectrometer was used to analyze the evolution of chemical bonds at various stages of the preparation process. Thermal analyses including thermal gravimetric analyzer, differential scanning calorimeter and thermo-mechanical analyzer were used to evaluate the level of enhancement on thermal and dimensional stabilities of the photoresist due to silica incorporation.
    Relation: Thin Solid Films 516(23), pp. 8399-8407
    DOI: 10.1016/j.tsf.2008.04.051
    Appears in Collections:[化學工程與材料工程學系暨研究所] 期刊論文

    Files in This Item:

    File SizeFormat
    0040-6090_516(23)p8399-8407.pdf1250KbAdobe PDF410View/Open

    All items in 機構典藏 are protected by copyright, with all rights reserved.


    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library & TKU Library IR teams. Copyright ©   - Feedback