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    請使用永久網址來引用或連結此文件: http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/45808

    題名: Improvement of thickness uniformity in nickel electroforming for the LIGA process
    作者: Yang, Hsiharng;康尚文;Kang, Shung-wen
    貢獻者: 淡江大學機械與機電工程學系
    關鍵詞: Thickness uniformity;Nickel electroforming;LIGA;Metallic microstructures
    日期: 2000-05-01
    上傳時間: 2010-03-26 19:59:56 (UTC+8)
    出版者: Elsevier
    摘要: An effective method to improve thickness uniformity in nickel electroforming for the LIGA process to produce metallic microstructures is described. The deposited metal distribution is naturally a concave shape over the whole area of the plating base proved by experiments. The edge thickness of the plating area is usually twice or higher than the center of the plating area. A secondary cathode (guard ring) was applied to improve the electroform uniformity. The experimental result of a Joule–Thomson micro-cooler proved its feasibility. The thickness ratio of edge to center of a 500 μm sample decreased from 2.5 to 1.4. The thickness uniformity improvement is achieved without a loss in plating rate in the center of the features.
    關聯: international journal of machine tools and manufacture 40(7), pp.1065-1072
    DOI: 10.1016/S0890-6955(99)00107-8
    顯示於類別:[機械與機電工程學系暨研究所] 期刊論文


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