淡江大學機構典藏:Item 987654321/45791
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    Please use this identifier to cite or link to this item: https://tkuir.lib.tku.edu.tw/dspace/handle/987654321/45791


    Title: A Comparison between Triangular Grooves, Star Grooves and Rhombus Grooves in Micro Heat Pipe Manufacture
    Other Titles: 三角形、星形與菱形微熱管製作與比較
    Authors: 蔡聲鴻;陳育堂;康尚文;Kang, Shung-wen;張裕民
    Contributors: 淡江大學機械與機電工程學系
    Keywords: Micro Heat Pipe (MHP);thermal conductivity;eutectic bonding
    Date: 2006-02
    Issue Date: 2010-03-26 19:57:17 (UTC+8)
    Publisher: 中國機械工程學會
    Abstract: This paper describes the development of
    triangular grooved MHP, star grooved MHP and
    rhombus grooved MHP their fabrication and testing.
    The heat transfer performance of micro heat pipe was
    enhanced due to the better capillarity provided by
    more acute angles and micro gaps. Triangular
    grooved MHP, Star grooved MHP and rhombus
    grooved MHP were fabricated by bulk micro
    machining on 4-inch (100) silicon wafers. Finally,
    triangular grooved MHP structure was bonded by
    employing anodic bonding technique. Star grooved
    MHP and rhombus grooved MHP structure was
    bonded by employing an eutectic bonding technique.
    Testing was conducted to evaluate the performance
    over a range of working fluid volume and heat fluxes.
    A heater was glued on the evaporator section of
    the heat pipe, cold water was poured through a
    copper pipe in the condenser section, and K-type
    thermocouples were pasted on the micro heat pipe in
    the direction of the length. Then the thermocouples
    were joined to a data acquisition system and Fourier’s
    Law was used to calculate the effective thermal
    conductivity. The best thermal conductivities of
    triangular grooved MHP, star grooved MHP and
    rhombus grooved MHP are 208 W/mK, 277.9 W/mK
    and 289.4 W/mK, respectively.
    Relation: Journal of the Chinese Society of Mechanical Engineers 27(1), pp.1-5
    DOI: 無
    Appears in Collections:[Graduate Institute & Department of Mechanical and Electro-Mechanical Engineering] Journal Article

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