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    Please use this identifier to cite or link to this item: https://tkuir.lib.tku.edu.tw/dspace/handle/987654321/45757


    Title: The SOI-like method of reducing the die size of bulk-micromachined sensors
    Authors: 楊龍杰;Yang, Lung-jieh;康尚文;Kang, Shung-Wen
    Contributors: 淡江大學機械與機電工程學系
    Date: 2002-01
    Issue Date: 2010-03-26 19:52:07 (UTC+8)
    Publisher: Scientific Publishing Division Myu
    Relation: Sensors and materials 14(1), pp.23-34
    Appears in Collections:[機械與機電工程學系暨研究所] 期刊論文

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