English  |  正體中文  |  简体中文  |  全文笔数/总笔数 : 62797/95867 (66%)
造访人次 : 3735802      在线人数 : 726
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library & TKU Library IR team.
搜寻范围 查询小技巧:
  • 您可在西文检索词汇前后加上"双引号",以获取较精准的检索结果
  • 若欲以作者姓名搜寻,建议至进阶搜寻限定作者字段,可获得较完整数据
  • 进阶搜寻


    jsp.display-item.identifier=請使用永久網址來引用或連結此文件: https://tkuir.lib.tku.edu.tw/dspace/handle/987654321/45738


    题名: Imposing compliance on grinding and polishing
    作者: 劉昭華;Liu, Chao-hwa;Chen, C.-C. A.;Li, Po-i;Hsu, Ta-chieh
    贡献者: 淡江大學機械與機電工程學系
    关键词: polishing;grinding;mould and die;process compliance;error compensation;tool wear;position errors;geometry errors;surface roughness;Taguchi methods;parameter design
    日期: 2005-01-01
    上传时间: 2010-03-26 19:50:49 (UTC+8)
    出版者: Inderscience
    摘要: Compliance is imposed upon the workpiece holder of a polishing/grinding system. Experiment results show that in a polishing process compliance may compensate position and geometry errors of the workpiece, and also compensate errors due to tool wear. During a grinding process it is shown that compliance may absorb high frequency disturbance from the outside, making grinding results unaffected. For a polishing system with compliance, experiment results suggest that soft springs (i.e. springs with greater values of compliance) may compensate workpiece geometry error better. Also, surface roughness decrease with increasing either translational or rotation speed of the polishing ring, and, up to a limit, a smaller pre-load depth gives rise to a smoother surface. A series of experiments based on Taguchi's method for parameter design are performed to determine better combinations of compliance with other polishing parameters, and results show that surface roughness may be greatly reduced.
    關聯: International Journal of Materials and Product Technology 22(4), pp.274-288
    DOI: 10.1504/IJMPT.2005.006457
    显示于类别:[機械與機電工程學系暨研究所] 期刊論文

    文件中的档案:

    档案 大小格式浏览次数
    index.html0KbHTML14检视/开启

    在機構典藏中所有的数据项都受到原著作权保护.

    TAIR相关文章

    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library & TKU Library IR teams. Copyright ©   - 回馈