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    题名: Performance Testing of Micro Loop Heat Pipes
    作者: Hsu, Chin-chun;康尚文;Kang, Shung-wen;Hou, Tung-fu
    贡献者: 淡江大學機械與機電工程學系
    关键词: Micro Loop Heat Pipes;Two Phase Flow;Non-condensable Gas;Thermal Resistance
    日期: 2005-06-01
    上传时间: 2010-03-26 19:43:44 (UTC+8)
    出版者: 淡江大學
    摘要: A 60 mm×33 mm×0.8 mm micro loop heat pipe (MLHP), consisting of an evaporator, vapor line, condenser and two liquid lines, was fabricated and characterized. The wicking structure consists of parallel V-grooves with a hydraulic diameter of 47 μm, 67 μm and 83 μm, and is formed by bulk silicon etching. The MLHP was realized by bonding a glass wafer onto a silicon substrate, so as to result in a transparent cover for two-phase flow visualization. Water and methanol were used as the working fluids. The test results showed that water demonstrates a wider heat load performance range (3.3W~12.96W) than methanol (1.2W~5.85W) for the MLHP with an evaporator area of 1 cm^2 and condenser temperature of 17℃. The best thermal resistance of the MLHP was 0.106℃/W, 64 times higher than that without fluid filling. The smaller diameter grooves caused the higher liquid capillarity and enhanced transfer capacity. It was observed that the presence of non-condensable gas negatively affected the reliability of the MLHP and significantly reduced the performance.
    關聯: 淡江理工學刊=Tamkang Journal of Science and Engineering 8(2), pp.123-132
    DOI: 10.6180/jase.2005.8.2.05
    显示于类别:[機械與機電工程學系暨研究所] 期刊論文

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