English  |  正體中文  |  简体中文  |  全文笔数/总笔数 : 56738/90513 (63%)
造访人次 : 12088520      在线人数 : 51
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library & TKU Library IR team.
搜寻范围 查询小技巧:
  • 您可在西文检索词汇前后加上"双引号",以获取较精准的检索结果
  • 若欲以作者姓名搜寻,建议至进阶搜寻限定作者字段,可获得较完整数据
  • 进阶搜寻


    jsp.display-item.identifier=請使用永久網址來引用或連結此文件: http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/45656


    题名: Fluid Dynamics and Heat Transfer Analysis of Three Dimensional Microchannel Flows with Microstructures
    作者: 洪祖昌;Hong, Zuu-chang;Zhen, Chaw-en;Yang, Chien-yuh
    贡献者: 淡江大學機械與機電工程學系
    日期: 2008-01-01
    上传时间: 2010-03-26 19:42:27 (UTC+8)
    出版者: Taylor & Francis
    摘要: The subsonic gas flows through straight rectangular cross-sectional microchannel with patterned microstructures was simulated using the direct simulation Monte Carlo (DSMC) method. An implicit treatment for low-speed inflow and outflow boundaries for the DSMC of the flows in microelectromechanical systems (MEMS) is employed. The 3-D microchannel flows are simulated with the cross-section aspect ratio ranging between 1 and 5. The comparison between 3-D cases and 2-D case shows that when the aspect ratio < 3, the two extra side-walls in the 3-D case have significant effects on the heat transfer and flow properties. When the aspect ratio increases, the flow pattern and heat transfer characteristics tend to approach those of 2-D results. The 2-D simplification is found to be reasonable when the cross-section aspect ratio is larger than 5. The microchannel flows with microstructures are also calculated with three different Knudsen numbers regime cases, and each case is calculated with three different microstructure temperatures, 273 K, 323 K, and 373 K. One Knudsen numbers regime ranges between 0.72 and 1.8, another regime ranges between 0.24 and 0.6 and the other regime ranges between 0.08 and 0.2. The computations show that the cooling and heating effects of the microstructure temperature on flow properties are enhanced with decreasing Knudsen number, and the higher microstructure temperature accelerates the velocity of the flow at the locations above the microstructures.
    關聯: Numerical Heat Transfer, Part A: Applications 54(3), pp.293-314
    DOI: 10.1080/10407780701790128
    显示于类别:[機械與機電工程學系暨研究所] 期刊論文

    文件中的档案:

    档案 大小格式浏览次数
    0KbUnknown223检视/开启

    在機構典藏中所有的数据项都受到原著作权保护.

    TAIR相关文章

    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library & TKU Library IR teams. Copyright ©   - 回馈