淡江大學機構典藏:Item 987654321/41272
English  |  正體中文  |  简体中文  |  全文筆數/總筆數 : 56570/90363 (63%)
造訪人次 : 11880805      線上人數 : 49
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library & TKU Library IR team.
搜尋範圍 查詢小技巧:
  • 您可在西文檢索詞彙前後加上"雙引號",以獲取較精準的檢索結果
  • 若欲以作者姓名搜尋,建議至進階搜尋限定作者欄位,可獲得較完整資料
  • 進階搜尋
    請使用永久網址來引用或連結此文件: http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/41272


    題名: Mathematical analysis of soft baking in photolithography
    作者: Hsu, Jyh-ping;Lin, Sung-Hwa;Chen, Wen-Chang;陳偉正;Tseng, Shio-jenn;曾琇瑱
    貢獻者: 淡江大學數學學系
    日期: 2001-02-01
    上傳時間: 2010-01-28 07:08:25 (UTC+8)
    出版者: College Park: American Institute of Physics (AIP)
    摘要: The soft baking step of a photolithography process is analyzed theoretically, taking the effect of the temperature dependence of the diffusivity of solvent into account. A coordinates-transform technique is chosen to solve the moving boundary problem under consideration. The temporal variation of the thickness of a film is predicted, and the result obtained justified by fitting experimental data reported in the literature for both poly(methylmethacrylate) film and Shipley UVIII photoresist. We show that, depending upon the types of photoresist film and the operating conditions, the transport of solvent may be controlled by the diffusion of solvent in a film or the convective transport of solvent from the gas–film interface to the bulk gas phase.
    關聯: Journal of Applied Physics 89(3), pp.1861-1865
    DOI: 10.1063/1.1335823
    顯示於類別:[數學學系暨研究所] 期刊論文

    文件中的檔案:

    檔案 描述 大小格式瀏覽次數
    0021-8979_89(3)p1861-1865.pdf73KbAdobe PDF602檢視/開啟
    index.html0KbHTML6檢視/開啟

    在機構典藏中所有的資料項目都受到原著作權保護.

    TAIR相關文章

    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library & TKU Library IR teams. Copyright ©   - 回饋