English  |  正體中文  |  简体中文  |  全文笔数/总笔数 : 56378/90242 (62%)
造访人次 : 11682622      在线人数 : 35
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library & TKU Library IR team.
搜寻范围 查询小技巧:
  • 您可在西文检索词汇前后加上"双引号",以获取较精准的检索结果
  • 若欲以作者姓名搜寻,建议至进阶搜寻限定作者字段,可获得较完整数据
  • 进阶搜寻


    jsp.display-item.identifier=請使用永久網址來引用或連結此文件: http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/41272


    题名: Mathematical analysis of soft baking in photolithography
    作者: Hsu, Jyh-ping;Lin, Sung-Hwa;Chen, Wen-Chang;陳偉正;Tseng, Shio-jenn;曾琇瑱
    贡献者: 淡江大學數學學系
    日期: 2001-02-01
    上传时间: 2010-01-28 07:08:25 (UTC+8)
    出版者: College Park: American Institute of Physics (AIP)
    摘要: The soft baking step of a photolithography process is analyzed theoretically, taking the effect of the temperature dependence of the diffusivity of solvent into account. A coordinates-transform technique is chosen to solve the moving boundary problem under consideration. The temporal variation of the thickness of a film is predicted, and the result obtained justified by fitting experimental data reported in the literature for both poly(methylmethacrylate) film and Shipley UVIII photoresist. We show that, depending upon the types of photoresist film and the operating conditions, the transport of solvent may be controlled by the diffusion of solvent in a film or the convective transport of solvent from the gas–film interface to the bulk gas phase.
    關聯: Journal of Applied Physics 89(3), pp.1861-1865
    DOI: 10.1063/1.1335823
    显示于类别:[數學學系暨研究所] 期刊論文

    文件中的档案:

    档案 描述 大小格式浏览次数
    0021-8979_89(3)p1861-1865.pdf73KbAdobe PDF601检视/开启
    index.html0KbHTML6检视/开启

    在機構典藏中所有的数据项都受到原著作权保护.

    TAIR相关文章

    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library & TKU Library IR teams. Copyright ©   - 回馈