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    题名: Mathematical simulation of soft baking in photoresist processing
    作者: Huang, Shi-Wei;Hsu, Jyh-ping;Tseng, Shio-Jenn;曾琇瑱
    贡献者: 淡江大學數學學系
    日期: 2000-05
    上传时间: 2010-01-28 06:59:00 (UTC+8)
    出版者: Pennington: Electrochemical Society
    摘要: The soft‐baking procedure in photoresist processing is investigated theoretically. A Landau transformation coupled with a finite-difference scheme is adopted to solving the moving‐boundary problem under consideration. The experimental data of Shipley SPR510LA, m-p cresol novolak, poly(methyl methacrylate), Shipley UVIII, and Shipley SNR200 photoresists reported in the literature are analyzed to justify the applicability of the model derived. We show that the concentration dependence of the diffusivity of solvent can have a significant influence on the soft‐baking procedure. The rate of transfer of solvent is controlled by the molecular diffusion of solvent in a film.
    關聯: Journal of the Electrochemical Society 147(5), pp.1920-1924
    DOI: 10.1149/1.1393458
    显示于类别:[數學學系暨研究所] 期刊論文


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