淡江大學機構典藏:Item 987654321/38187
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    题名: Flat plate loop heat pipe with a novel evaporator structure
    作者: Tsai, Meng-chang;Yu, Chun-sheng;Kang, Shung-wen
    贡献者: 淡江大學機械與機電工程學系
    日期: 2005-03-15
    上传时间: 2010-04-15 10:31:11 (UTC+8)
    出版者: Piscataway: Institute of electrical and electronics engineers (IEEE)
    摘要: The paper proposes the fabrication and test of flat plate loop heat pipe (FPLHP) with a novel evaporator structure. The IC industry of Taiwan, ROC is one of the most competitive industries in the world. With the increase in electric heat dissipation and miniaturization, we need advanced cooling systems to solve the high temperature problems. We describe the evaporator design and a new stretched design. Finally, the test results show that the new design of FPLHP works very well.
    關聯: Semiconductor Thermal Measurement and Management Symposium, 2005 IEEE Twenty First Annual IEEE, pp.187-190
    DOI: 10.1109/STHERM.2005.1412177
    显示于类别:[機械與機電工程學系暨研究所] 會議論文

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