Piscataway: Institute of electrical and electronics engineers (IEEE)
Abstract:
The paper proposes the fabrication and test of flat plate loop heat pipe (FPLHP) with a novel evaporator structure. The IC industry of Taiwan, ROC is one of the most competitive industries in the world. With the increase in electric heat dissipation and miniaturization, we need advanced cooling systems to solve the high temperature problems. We describe the evaporator design and a new stretched design. Finally, the test results show that the new design of FPLHP works very well.
Relation:
Semiconductor Thermal Measurement and Management Symposium, 2005 IEEE Twenty First Annual IEEE, pp.187-190
