English  |  正體中文  |  简体中文  |  Items with full text/Total items : 49266/83828 (59%)
Visitors : 7144202      Online Users : 78
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library & TKU Library IR team.
Scope Tips:
  • please add "double quotation mark" for query phrases to get precise results
  • please goto advance search for comprehansive author search
  • Adv. Search
    HomeLoginUploadHelpAboutAdminister Goto mobile version
    Please use this identifier to cite or link to this item: http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/38064


    Title: 矽質微型感測器應用於微流道的現地量測
    Authors: 楊龍杰;Yang, Lung-jieh;楊賢政;康尚文
    Contributors: 淡江大學機械與機電工程學系
    Keywords: 微熱傳;微感測器;微流道加工;Micro Heat Transfer;Micro Sensor;Microchannel Machining
    Date: 1999-10
    Issue Date: 2010-01-11 14:35:56 (UTC+8)
    Publisher: 臺北市 : 中華民國力學學會
    Abstract: 在微流體力學系統中,以(110)矽晶片製作的U型槽與Corning7740玻璃鍵合而成的微流道研究時有所聞。微流道系統具有極小水利直徑(Hydraulic diameter)與高深寬比(Aspect ratio)本質特性,從傳統流體力學的觀點看來,該特性能適用於高熱通量的熱交換器系統。但是在微米級的尺度下,許多流體的基本假設仍然備受爭議。在本篇文章中提議利用微感測器直接量測微流道內溫度與壓力的變化,其作法是在玻璃與矽質微流道鍵合之前,先利用體型微加工技術(Silicon bulk micromachining)於玻璃基材上製作微感測器,包括壓阻式微壓力感測器與白金薄膜溫度感測器。而文中探討的微流道,水利直徑小於1 00微米,深寬比介於3至10之間,能夠滿足個人電腦中央處理器100W/cm/sup 2/的散熱性能要求。
    The micro-channel fabricated on (110) silicon and bonded with Corning 7740 glass was frequently studied in micro-scale fluidic systems. The ultra-low value of hydraulic diameter and the high aspect- ratio configuration of the micro-channel make it the right stuff in cooling the high-flux beat-exchanging systems from the classical aspect of fluid dynamics. However, a lot of fundamental issues in such small-scale flow are still under dispute. In this paper, by the silicon bulk-micromachining, the on-site micro-sensors are fabricated on the Corning 7740 glass before the substrate bonding. The micro piezo-resistive pressure sensor chip and the platinum temperature sensor with high TCR value all design on the glass substrate as on-site sensors. The micro-channels with hydraulic diameter below 100 micrometers and the aspect ratio from 3 to 10 in this work could match the real application of the micro-channel heat sink subject to CPU cooling in the very-near future.
    Relation: 中華民國力學學會第廿三屆全國力學會議論文集(二)=Proceedings of the 23nd National Conference on Theoretical and Applied Mechanics (II),頁9-14
    Appears in Collections:[機械與機電工程學系暨研究所] 會議論文

    Files in This Item:

    File SizeFormat
    index.html0KbHTML131View/Open

    All items in 機構典藏 are protected by copyright, with all rights reserved.


    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library & TKU Library IR teams. Copyright ©   - Feedback