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    題名: In-situ monitoring of thickness of quartz membrane during batch chemical etching using a novel micromachined acoustic wave sensor
    作者: Lee, Chi-yuan;Lee, Chi-yuan;Wu, Tsung-tsong;Chen, Yung-yu;Pao, Shih-yung;Chen, Wen-jong;Cheng, Ying-chou;Chang, Pei-zen;Chen, Ping-hei;Lee, Chih-kung;Dai, Ching-liang;楊龍杰;Yang, Lung-jieh;Yen, Kaih-siang;Xiao, Fu-yuan;Liu, Chih-wei;Lu, Shui-shong
    貢獻者: 淡江大學機械與機電工程學系
    日期: 2003-05-04
    上傳時間: 2010-04-15 10:29:57 (UTC+8)
    出版者: Piscataway: Institute of Electrical and Electronics Engineers (IEEE)
    摘要: This work presents a novel method based on the surface acoustic wave (SAW) device for monitoring in-situ the thickness of quartz membrane during batch chemical etching. Similar to oscillators and resonators, some SAW devices require the thickness of quartz membranes to be known precisely. Precisely controlling the thickness of a quartz membrane during batch chemical etching is important, because it strongly influences post-processing and frequency control. Furthermore, the proposed micromachined acoustic wave sensor, allows the thickness of a quartz membrane from a few μm to hundreds of μm to be monitored in-situ. In particular, the proposed method is highly appropriate for monitoring in-situ a few μm thick quartz membranes, because the thickness of a quartz membrane is proportional to the phase velocity. In summary, the proposed method for measuring the thickness of quartz membrane in real time, has high accuracy, is simple to set up and can be mass produced. Also described herein are the principles of the method used, the detailed process flows, the measurement set-up and the simulation and experimental results. The theoretical and measured values differ by an error of less than 2 μm, so the results agreed with each other closely.
    關聯: Proceedings of the 2003 IEEE International Frequency Control Symposium and PDA Exhibition Jointly with the 17th European Frequency and Time Forum, pp.993-1000
    DOI: 10.1109/FREQ.2003.1275226
    顯示於類別:[機械與機電工程學系暨研究所] 會議論文

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