本文對兩種不同毛細結構的蒸汽腔體均熱片，進行充填率及均溫性的測試與分析。T5型均熱片外觀尺寸90.83mm 87.63mm 3.9mm，使用柱狀銅粉燒結作為毛細結構；R0型均熱片的外觀尺寸為58mm 58mm 6mm，使用向中心傾斜的輻射狀溝槽作為毛細結構，溝槽寬度為0.4mm。兩款均熱片的熱性能，分別是以加熱面積31mm 31mm與13.97mm 13.97mm的CPU風扇-散熱鰭片熱阻量測設備作實驗性評價，測試時壓力負載平台均勻施以12.5kgf的壓力。 結果顯示，T5型均熱片充填35%去離子水(D.I water)時效果最好，在實際加熱功率為122瓦特情況下，系統熱阻值為0.368℃/W，比同體積的銅塊熱阻降低14.62%，均熱片上蓋各量測點最高與最低溫差為1.69℃，顯示溫度分佈均勻。R0型均熱片充填20%去離子水時效果優於其他充填率，在加熱功率73瓦特的情況下，系統熱阻值為0.778℃/W；由於依然較同體積銅塊高出0.446℃/W，經由實驗結果推測可能是溝槽寬度過大，以致毛細力不足。 The main purpose of present study is to investigate the effect of various wicks and filling rate on vapor chamber heat spreader thermal performance. The T5 type vapor chamber has a dimension of 90.83mm×87.63mm×3.9mm, and the sintered columns made of copper powder were used as the wick. The R0 has a dimension of 58mm×58mm×6mm, and the capillary wick design was consisted of radial rectangular grooved. Thermal performance of the vapor chambers were evaluated experimentally in a fan-heat sink CPU test apparatus with heating area of 31mm 31mm and 13.97mm 13.97mm. The clamping pressure between the vapor chamber and the heat sink was maintained at 12.5kgf during the test. After the evaluation, the T5 type vapor chamber with 35% D.I water filling rate showed the lowest evaporator-to-ambient resistance of 0.368℃/W, corresponding to a 14.62% decrease in thermal resistance at an input power of 122Watts, as compared to the system with copper plate. The results also showed a temperature difference lower than 1.69℃ on the entire condenser section, implied that the heat were spread uniformly to the heat sink. The R0 vapor chamber with 20% D.I water filling rate has the best performance as compared to the other filling rates. At the input power of 73Watts, the thermal resistance was 0.778℃/W, and it was still higher than copper plate about 0.446℃/W. We infer that larger channel width may cause poor capillarity.
