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    Please use this identifier to cite or link to this item: https://tkuir.lib.tku.edu.tw/dspace/handle/987654321/35476


    Title: 迴路式虹吸熱管模擬與性能測試之研究
    Other Titles: A study of simulation and thermal performance on loop thermosyphon
    Authors: 林誌咸;Lin, Chih-hsien
    Contributors: 淡江大學機械與機電工程學系碩士班
    康尚文;Kang, Shung-wen
    Keywords: 迴路式虹吸熱管;熱傳風洞;增強沸騰結構;Loop Thermosyphon;wind tunnel;Enhanced Boiling Structure
    Date: 2009
    Issue Date: 2010-01-11 06:38:13 (UTC+8)
    Abstract: 本研究之迴路式虹吸熱管包含蒸發端、冷凝端,且其蒸發室內徑及高度皆為25mm。冷凝區管路的設計,使用七個平滑垂直館的方式,其外部尺寸為90mmx19mmx106mm,並經由Icepak熱流分析軟體,模擬出鳍片整體體積為76mmx60mmx67mm,鳍片間隙為8mm之散熱鰭片,並與此迴路式虹吸熱管進行組裝。本實驗採用三種增強沸騰結構,分別為無燒結結構、厚度1mm與4mm的燒結結構。工作流體為去離子水,於熱傳風洞尺寸大小為1040mmx200mmx200mm測試機台上,於不同風速(5.05m/s、3.09m/s、1.79m/s)、充塡量及增強沸騰結構進行測試比較。另外再以不同真空度,來探討對此迴路式虹吸熱管的性能影響。從實驗結果顯示,風洞風速、充塡量、增強沸騰結構及真空度對整體散熱性能有直接影響。
    Experimental investigations were performed on a loop thermosyphon, consisting of a condensation section and an evaporation section. The evaporator chamber used in this study has an inside diameter of 25mm and height of 25mm. Three evaporators, without wick structure and with 1mm and 4mm thickness wick structures were examined in the test. The condenser is composed of 7 vertical smooth copper tubes with the dimensions of 90mmx19mmx106mm, According to the simulation result by Icepak, the volume of the plate fin heat sink is 76mmx60mmx67mm and the fin gap is 8mm, which are fabricated with loop thermosyphon. The experiments were conducted under the condition of 5.05m/s, 3.09m/s, and 1.79m/s wind velocity at surrounding temperature of 27°C, for heating powers from 20 to 80W, working fluid fill ratios of 10%, 20%, 30%, 40%, and 50%. The experiments used water as the working fluid. When the system reached the steady state, the temperature was recorded in order to evaluate the performance of the thermosyphon. Effect of wind velocity, fluid fill ratio evaporator type and vacuum pressure were studies. Finally the results show that the wick structure can enhance the heat transfer effects directly.
    Appears in Collections:[機械與機電工程學系暨研究所] 學位論文

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