本研究利用濕蝕刻製程技術在環氧玻璃感光電路板上製作微銅保險絲。保險絲結構尺寸長為600μm，寬為80μm，銅層厚度為30μm。 在數值模擬研究中，利用ANSYS軟體對保險絲輸入不同的電壓來預測溫度的變化。微保險絲經由控制蝕刻時間來獲得不同的截面積。實驗時，輸入電源以0.1安培電流為增加間隔，一直輸入到保險絲之熔斷電流，並擷取保險絲的特性變化。 實驗結果顯示量測溫度和模擬的數據一致。且所製作三種額定電流1.15安培、1.60安培及 2.10安培之微保險絲，在額定電壓3.6伏特中皆測試通過國際標準安全規格。 In this study, a micro copper fuse was developed on glass epoxy plate by wet etching technology. The fuse structure has a length of 600μm and a width of 80μm.The thickness of the copper layer is 30μm. Numerical simulation was studied with ANSYS software to predict the temperature distribution of micro fuse with variation of input voltage. Different cross-section area of micro fuse was obtained from controlling etching time. The characteristic of the fuse were evaluated experimentally by input power to its blowing current with an increment of 0.1A. Measured temperature showed a good agreement with the simulation data. Under safety standard test requirement, the normal rated current of the design micro fuses are 1.15A, 1.60A and 2.10A at an input voltage of 3.6V.
