English  |  正體中文  |  简体中文  |  全文筆數/總筆數 : 56570/90363 (63%)
造訪人次 : 11885012      線上人數 : 58
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library & TKU Library IR team.
搜尋範圍 查詢小技巧:
  • 您可在西文檢索詞彙前後加上"雙引號",以獲取較精準的檢索結果
  • 若欲以作者姓名搜尋,建議至進階搜尋限定作者欄位,可獲得較完整資料
  • 進階搜尋
    請使用永久網址來引用或連結此文件: http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/35459


    題名: 均熱片之製造與分析
    其他題名: Fabrication and analysis on heat spreaders
    作者: 蔡聲鴻;Tsai, Sheng-hong
    貢獻者: 淡江大學機械與機電工程學系博士班
    康尚文;Kang, Shung-wen
    關鍵詞: 微幅射流道均熱片;金屬微均熱片;擴散接合;共晶接合;濕式體蝕刻;micro radial channel heat spreaders;metallic micro heat spreaders;micro heat pipe;diffusion bonding;bulk micromachining;eutectic bonding;electronics cooling
    日期: 2005
    上傳時間: 2010-01-11 06:36:07 (UTC+8)
    摘要: 本文以不同的製造技術研製三種不同材質與結構的均熱片,在材料方面,分別使用矽晶片、紅銅與無氧銅作為腔體設計;成型方面,使用濕式體蝕刻、化學蝕刻與線切割加工技術,再分別以共晶結合、擴散接合與錫焊等技術結合成一體,並測試與分析其效能,均熱片可應用於產生高溫的電子元件,例如在筆記型電腦微處理器(CPU)與印製電路板(PCBs)的冷卻等。
    文中首先以光微影、濕式體蝕刻與共晶接合等製程技術並配合汽-液流道分離式熱管之概念,製作一50 x 50 mm2的矽質輻射狀微流道均熱片於4吋(100)矽晶片上。性能測試上,改變充填量與輸入功率等因素,量測晶片表面溫度變化。結果顯示,70%充填量之微流道均熱片於27.4W輸入功率下較其他試片具有較好之均熱能力。蒸發段溫度為 67℃,比實體的矽結構試片低27.1%,蒸發段與冷凝段之溫差為47℃,此值比實體的矽結構低32.9%。蒸發段底部與頂部之溫度差僅約12.5℃,比實體的矽結構試片低78%。
    其次利用化學蝕刻、擴散接合技術,在金屬銅材上製作出一長×寬×高為31mm × 31mm × 2.7mm且具備液汽分離設計之三層結構的金屬微均熱片。同時以CPU冷卻器熱阻量測裝置,探討溝槽式、銅網式兩種毛細構造的微均熱片在不同甲醇充填率下,對熱點表面溫度和系統熱阻的影響程度。結果顯示,82%甲醇充填率的溝槽式微結構均熱片性能優於其他充填率之均熱片。與未加上均熱片的冷卻系統作比較時,在加熱功率35W下,加熱面溫度降低17℃,系統熱阻可降低30%。
    最後利用銅空心管為主要腔體製作一新型均熱片,以銅網為毛細結構,中央由線切割加工之交叉結構支撐,尺寸為73mm×48.5mm×2.7mm。加熱源為30mm×30mm陶瓷加熱片,輸入功率由10W遞增至130W,冷卻的裝置為風扇與散熱鰭片,結果顯示,交叉結構均熱片的性能優於相同尺寸之紅銅片,當加熱功率為130W時,均熱片的熱源溫度為68.8℃,系統熱阻值為0.363℃/W,與紅銅片比較,熱源溫度降低4.3℃,系統熱阻降低5.7%;加熱功率為60W時,均熱片系統熱阻為0.311℃/ W,與紅銅片比較,熱源溫度降低3.9℃,系統熱阻降低22%。此外利用紅外線熱影儀攝錄其表面溫度證實均熱片之均溫性,最後利用數值模擬分析比對實驗數據計算均熱片之等效熱傳導係數k 值為850W/ m∙k。
    In this study, three heat spreaders made of different materials and having different configurations were studied by various manufacturing technologies. Silicon, copper and oxygen free copper were used for chamber materials design. Wet bulk micromachining, chemical machining and wire cut manufacturing technology were used for chamber fabrication, and then the integration was carried out by technologies like eutectic bonding, vacuum diffusion bonded and tin welding. Besides, their effectiveness was tested and analyzed. Heat spreaders are applicable to electronic devices, which generate heats, like a notebook microprocessor and a cooler for PCBs.
    A 50 x 50 mm2 heat spreader of silicon radial micro channel on a 4 inches (100) silicon chip was prepared and illustrated in this article by the concept of manufacturing technologies of photolithography, wet bulk micromachining and eutectic bonding associated with a vapor-liquid channel separate heat pipe. For its function test, the proportion of fill and input power were varied to see the temperature changes of chip surface. The results showed that the micro channel heat spreader with 70% fill had better heat spreading ability than abilities of other test spreaders at the input power of 27.4 W. The temperature of evaporating region was 67℃, which was 27.1% lower than that of a materialized silicon test spreader; the temperature difference between evaporating and condensing regions was 47℃, which was 32.9% lower than that of a materialized silicon one. The temperature difference between the bottom and the top of evaporating region was only 12.5℃, which was 78% lower than that of a materialized silicon test spreader.
    Afterward, a metallic micro heat spreader having the 3-layer configuration of the design of separate liquid and vapor and being 31 mm × 31 mm × 2.7 mm as length × width × height on a copper substrate was prepared. Besides, effects of two micro heat spreaders having capillary constructions of trench and copper hybrid on hot spot surface temperature and system thermal resistance in the presence of various fill proportion of methanol were investigated by CPU cooler thermal resistance test apparatus. After evaluation, the heat spreader with 82% methanol fill rate, radial groove wicking structure showed the best performance compared to the other samples. The superior heat spreader had lower evaporator temperature with a 17℃ value, corresponding to a 30% decrease in system thermal resistance at an actual input power of 35W, compared to the system without heat spreader.
    Finally, a novel heat spreader was prepared with its main cavity of copper hollow pipe, where copper mesh served as the capillary construction, the centre was supported by a crossed structure manufactured with wire cut and the size was 73 mm × 48.5 mm × 2.7 mm. The heating source was a 30 mm× 30 mm ceramic heater with the output power raised from 10 W to 130 W, and the coolers were a fan and assembled fin heat sinks. The result showed that the heat spreader with crossed structure had better performance than that of a copper one of the same size. When heating power was 130 W, the heat source temperature of heat spreader was 68.8℃ and the system thermal resistance was 0.363℃/W. Compared to a copper spreader, the heat source temperature was lowered by 4.3℃ and the system thermal resistance was lowered for 5.7%. When heating power was 60 W, the system thermal resistance of heat spreader was 0.311℃/W. Compared to a copper spreader, the heat source temperature was lowered by 3.9℃ and the system thermal resistance was lowered for 22%. In addition, the homogeneous temperature distribution of the heat spreader was identified by its surface temperature recorded by IR thermal imager. The experimental data were compared with numerical simulation and analysis to afford that the equivalent thermal conductivity, k, of the heat spreader was 850 W/ m∙k.
    顯示於類別:[機械與機電工程學系暨研究所] 學位論文

    文件中的檔案:

    檔案 大小格式瀏覽次數
    0KbUnknown242檢視/開啟

    在機構典藏中所有的資料項目都受到原著作權保護.

    TAIR相關文章

    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library & TKU Library IR teams. Copyright ©   - 回饋