精密輪磨加工硬脆材料中加工參數對表面性狀之影響研究

淡江大學機構典藏 > 工學院 > 機械與機電工程學系暨研究所 > 學位論文 > Item 987654321/35394

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題名:	精密輪磨加工硬脆材料中加工參數對表面性狀之影響研究
其他題名:	Study on the influence of grinding conditions on the surface integrity of the precision ground brittle materials
作者:	趙展毅;Chao, Chan-yi
貢獻者:	淡江大學機械與機電工程學系碩士班趙崇禮;Chao, Choung-lii
關鍵詞:	交錯磨削;平行磨削;電解線上削銳;表面性狀;火花消失;cross grinding;parallel grinding;ELID;Surface Integrity;Spark-out
日期:	2009
上傳時間:	2010-01-11 06:28:51 (UTC+8)
摘要:	近年來，由於硬脆材料與超精密加工技術的快速發展，加工效率與加工品質的要求逐漸提高。目前業界加工硬脆材料主要以切削與磨削為主，而磨削硬脆材料之加工效率較切削快，且透過延性加工模式之實現可以得到優良的表面粗糙度與形狀精度。在形狀精度及表粗要求日益提高的光電領域，磨削已然成為一項關鍵的加工技術。本研究以單晶矽為加工工件，研究各項磨削參數對象如切深、進給、轉速等；磨削方式如交錯磨削與平行磨削，及削銳方式對加工表面及次表面所造成的影響。此外對火花消失對加工表面性狀產生的影響亦加以探討；以整理出磨削參數與表面粗糙度及次表面相變化的關係。 Owing to the rapid development in new materials and ultra-precision machining techniques, the demands from industry for higher machining efficiency and machining quality are also increasing. In order to meet these requirements, brittle materials are mainly machined by precision diamond turning and diamond grinding. By keeping the cutting process within the ductile regime, diamond grinding can offer superb surface finish, good form accuracy and, in comparison to diamond turning, better machining efficiency. This research aimed to investigate the influences of grinding parameters such as cut depth, feed rate, spindle speed; ways of grinding process namely cross grinding and parallel grinding; and dressing techniques on the obtained surface integrity. Single crystal silicon was selected as the work material in this study. Field emission scanning electron microscope(FESEM), Alfa-step, optical microscope, and transmission electron microscope(TEM) were used to examined the obtained surface/subsurface. The effect of spark-out was also investigated.
顯示於類別:	[機械與機電工程學系暨研究所] 學位論文

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