近年來，由於硬脆材料與超精密加工技術的快速發展，加工效率與加工品質的要求逐漸提高。目前業界加工硬脆材料主要以切削與磨削為主，而磨削硬脆材料之加工效率較切削快，且透過延性加工模式之實現可以得到優良的表面粗糙度與形狀精度。在形狀精度及表粗要求日益提高的光電領域，磨削已然成為一項關鍵的加工技術。 本研究以單晶矽為加工工件，研究各項磨削參數對象如切深、進給、轉速等；磨削方式如交錯磨削與平行磨削，及削銳方式對加工表面及次表面所造成的影響。此外對火花消失對加工表面性狀產生的影響亦加以探討；以整理出磨削參數與表面粗糙度及次表面相變化的關係。 Owing to the rapid development in new materials and ultra-precision machining techniques, the demands from industry for higher machining efficiency and machining quality are also increasing. In order to meet these requirements, brittle materials are mainly machined by precision diamond turning and diamond grinding. By keeping the cutting process within the ductile regime, diamond grinding can offer superb surface finish, good form accuracy and, in comparison to diamond turning, better machining efficiency. This research aimed to investigate the influences of grinding parameters such as cut depth, feed rate, spindle speed; ways of grinding process namely cross grinding and parallel grinding; and dressing techniques on the obtained surface integrity. Single crystal silicon was selected as the work material in this study. Field emission scanning electron microscope(FESEM), Alfa-step, optical microscope, and transmission electron microscope(TEM) were used to examined the obtained surface/subsurface. The effect of spark-out was also investigated.
