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    Title: 銅/奈米碳管複合材料製造暨磨潤性質
    Other Titles: Manufacturing and tribological properties of copper/carbon nanotube composites
    Authors: 董育煌;Tung, Yu-huang
    Contributors: 淡江大學機械與機電工程學系碩士班
    林清彬;Lin, Ching-bin
    Keywords: 銅基/奈米碳管複合材料;無電解電鍍銅;磨潤;摩擦係數;Copper/carbon nanotube composite;Electroless plating;Tribology;Friction coefficient
    Date: 2005
    Issue Date: 2010-01-11 06:28:05 (UTC+8)
    Abstract: 本研究利用水合原理及無電解電鍍銅製程,成功地將銅鍍在奈米碳管表面上。並利用單向加壓成形及真空高溫燒結下,成功製得銅基/5、10、15及20vol.%奈米碳管複合材料。本研究並探討銅基/奈米碳管複合材料與麻田散鐵化S45C碳鋼(HRC60)進行乾磨耗時,不同奈米碳管含量,滑動速率(1.23m/s、2.45m/s與4.90m/s)及荷重(0.44MPa、0.74MPa與1.03MPa)對銅基/奈米碳管複合材料之磨耗性質影響。實驗結果,摩擦係數隨著奈米碳管含量增加而降低;當奈米碳管含量為10vol.%時,其磨耗率最低。滑動速率增加時,由於滑滯現象的影響加劇,使得摩擦係數與接觸電阻隨著滑動速率增加而上升。荷重增加時,由於滑滯現象減小及犁割與黏著磨耗加重之對磨耗正負面效應影響下,磨潤性質不隨荷重增加有明顯改變。對所有磨耗數據而言,當PV值為1.802時,由於系統發生劇烈振動,造成滑滯現象更為嚴重,導致磨耗率最高;至於PV值對於摩擦係數則無明顯影響。
    This study has used successfully the cementation process and the electroless plating method to coat uniformly a copper layer on the surface of carbon nanotube. Then the copper/5, 10, 15 and 20vol.% carbon nanotube composites are made by one-way pressure and vacuum sintering method. The effect of content of carbon nanotube、sliding velocity and load effect on the tribology properties of copper/carbon nanotube composites to Martensitze S45(HRC60) under dry wear are also investigated. The experimental results showed that the friction coefficient increased with decreasing the content of carbon nanotube, which the content of carbon nanotube is 10vol.% can be get the lowest wear rate. The stick-slip effect becomes serious, resulting in the friction coefficient and the contact resistance increased with increasing the sliding velocity. However, tribology properties don’t change apparently with increasing the load because the positive effect of decreasing the stick-slip phenomenon and the negative effect of increasing the plough and adhering wear. For all results, when PV value is 1.802, the wear rate is the highest owing to vibration and stick-slip phenomenon are more serious.
    Appears in Collections:[機械與機電工程學系暨研究所] 學位論文

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