本研究係使用模擬軟體CoventorWare，分析一parylene為主體材料的三明治結構，對其進行熱電耦合的分析。 本文以改良由本研究群所研製之上電極式微幫浦於製作上諸多缺點，以在單一平面上加工之下電極式微幫浦，取代需要攀爬多層材料之上電極式微幫浦，以矽質材料作為底材，於晶圓背面施以濕蝕刻後，掏空濕蝕刻所形成之V型槽 （V-groove），以利電極做動裕度，並在晶圓正面上正光阻作為犧牲層（sacrificial layer）製作出一立體結構，利用parylene薄膜為結構層，來包覆住光阻犧牲層，在溶除光阻犧牲層後， 即完成一下電極式微幫浦。 在輸入方波電壓並通以DI water 加以驅動後，成功地在製作之PDMS流道中量測到液體流量，而作動溫度不但未超過50℃，及最大流量更可達23.8 nl /min，期待能以此低溫運作之特性，使應用面更為廣闊。 This study is using coventorware to simulate a sandwich structure whtich mold by parylene. We also use this software to design and thermoelectric coupling. This paper present the fabrication and analysis for a novel valveless micropump with working in a low temperature environment.We chose the parylene-c for the main material and success of production at an appropriate temperature which can drive a thermal actuating device. We Use TMAH to etch silicon wafer for the suspension pumping film, it may make a Application at a novel micropump. Under the scale of micrometers, not only can actuate under 40℃ but also provide the velocity about 23.8 nl /min. In the future, it also can transport pharmaceuticals by the microchannel system with micropumps.
