淡江大學機構典藏:Item 987654321/35362
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    題名: 雙相共平面基材之潤濕機制
    其他題名: The wetting mechanism of bi-phase coplanar substrate
    作者: 李宏洲;Lee, Hung-chou
    貢獻者: 淡江大學機械與機電工程學系碩士班
    林清彬;Lin, Ching-bin
    關鍵詞: 共平面雙相基材;接觸角;動態氣墊;bi-phase coplanar substrate;contact angle;dynamic air cushion
    日期: 2006
    上傳時間: 2010-01-11 06:26:15 (UTC+8)
    摘要: 本研究係以微影製程及類化學氣相沉積製程，製備俱親水性二氧化矽及疏水性F13-TCS自我組裝單分子層之共平面雙相基材，並定義共平面之意義；以共平面雙相基材及俱微結構二氧化矽基材探討Cassie & Baxter''s model。共平面雙相基材之平均接觸角隨著疏水性第二相的面積比例增加而上升，且第二相面積比例75％之共平面雙相基材的平均接觸角與100％第二相面積比例之基材的平均接觸角相當；共平面雙相基材之平均接觸角皆高於以Cassie & Baxter''s model推導之理論值。液體於微結構基材表面的平均接觸角可因殘留於凹穴之氣體形成封閉氣室而提高；共平面雙相基材表面之雙相交互作用使空氣殘留於固—液界面之間，而形成不同於一般封閉氣室的動態氣墊，且液體潤濕表面因存有動態氣墊而變形，不再是一平整表面，且共平面雙相基材原理想之固—液潤濕界面可能以液—氣界面之潤濕行為呈現，接觸角亦因氣墊效應而上升。
    In this thesis, the bi-phase coplanar substrate including hydrophilic SiO2 and hydrophobic F13-TCS self-assembled monolayer was manufactured by lithography and chemical vapor deposition processes, and the meaning of “coplanar” was also defined. Cassie & Baxter''s model was investigated through the bi-phase coplanar and micro-structured SiO2 substrate. The average contact angle of the bi-phase coplanar substrate was raised with the increasing of the hydrophobic surface area, and the average contact angle of the bi-phase coplanar substrate with 75% hydrophobic surface area fraction was almost equaled to 100% hydrophobic surface substrate. The average contact angles of bi-phase coplanar substrates were all higher than those calculated through Cassie & Baxter''s model. The average contact angle of the micro-structured substrate was raised by closed air cushion due to the air trapped in the microstructure. Because of the interaction between hydrophilic and hydrophobic phase on the bi-phase coplanar substrate surface, the air was trapped at the solid-liquid interface and formed dynamic air cushion instead of closed one. The wetting surface of the liquid wasn''t a flat surface and transformed due to dynamic air cushion, and the wetting mechanism of the bi-phase coplanar substrate was assumed like liquid-air wetting behavior instead of original ideal solid-liquid wetting behavior. The average contact angle was also raised by air cushion effect.
    顯示於類別:[機械與機電工程學系暨研究所] 學位論文

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