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    題名: 熱傳導對焙炒爐中溫度場的效應
    其他題名: The analysis of thermal conduction effects within a heating furnace
    作者: 馬紹棠;Ma, Shai-tang
    貢獻者: 淡江大學機械與機電工程學系碩士班
    顏政雄;Yen, Chen-shyong
    關鍵詞: 焙炒爐;芝麻;熱傳導;溫度場;heating furance;sesame;thermal conduction;temperature field
    日期: 2006
    上傳時間: 2010-01-11 06:20:26 (UTC+8)
    摘要: 本論文主要是針對於各種不同爐壁材質的焙炒爐,利用ANSYS軟體模擬在焙炒的過程中,探討爐壁、芝麻及空氣的溫度變化,進而分析熱傳導對於溫度場的影響。研究分為兩個部分,第一為實驗部分,芝麻的熱傳導係數量測,在溫度範圍20 ~ 60 oC時,以相同質量的芝麻,分別針對原始芝麻(含水率7 %)及含水率3 %的芝麻進行測量,測量結果含水率7 %的熱傳導係數為0.0638 W/moC;含水率3 %的熱傳導係數為0.0624 W/moC。
    第二為模擬分析部分,利用ANSYS軟體進行模擬分析,在相同的條件下,分別對中碳鋼、鉻鋼、鎳鉻鋼及鋁合金進行模擬,分析以這四種不同的材質作為爐體時溫度場的變化,可發現熱傳導係數愈大者,其溫度場的變化愈接近所要的設定條件,依熱傳導係數由大到小的排列為:鋁合金 > 鉻鋼 > 中碳鋼 > 鎳鉻鋼,經由比較分析的結果,得知鋁合金的爐體最為適合芝麻的焙炒。
    Different wall-materials of the heating furnace have been studied in this thesis. During the process of baking, the changes of temperature among furnace, sesame and air are simulated by software ANSYS. The content is divided into two parts. The first is an experiment to measure the thermal conductivity of sesame during temperature range from 20 oC to 60 oC by considering two different moistures 3 % and 7 %. The thermal conductivities of the two different moistures 3 % and 7 % are 0.0624 W/moC and 0.0638 W/moC respectively.
    The second part is a simulation. Under the same conditions, ANSYS software is chosen to simulate the heating furnaces with four different materials (Carbon steel, Chromium steel, Nickel Chromium steel and Aluminium alloy) and to analyse their temperature fields. From the result, it is shown that the material has a higher thermal conductivity, the result is closer to be required. The thermal conductivities of these four materials make arrangement from large to small : Aluminium alloy > Chromium steel > Carbon steel > Nickel Chromium steel. It is shown that the best material of the heating furnace is Aluminium alloy, and the worst is Nickel Chromium steel.
    顯示於類別:[機械與機電工程學系暨研究所] 學位論文

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