淡江大學機構典藏:Item 987654321/35293
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    题名: 焙炒爐的熱對流分析
    其它题名: The heat transfer analysis of the rotary kiln with heat convection
    作者: 蔡秉均;Tsai, Bing-jiun
    贡献者: 淡江大學機械與機電工程學系碩士班
    顏政雄;Yen, Chen-shyong
    关键词: 流場效應;熱傳導係數;有限元素軟體;紊流流場;field flow;thermal conductivity;ANSYS;turbulent flow;Laminar flow;rotary kiln;temperature distribution
    日期: 2005
    上传时间: 2010-01-11 06:19:34 (UTC+8)
    摘要: 本論文主要探討流場效應與熱對流引生焙炒爐溫度之變化，研究在不同的流場流速下之焙炒爐溫度場的分佈情形，內容分為實驗量測與數值分析兩部分。在實驗方面，量測含水率12% 芝麻在溫度5～60℃之間的熱傳導係數，並以數值方法求得K值：

    K= 0.0604 W/m℃

    由於12% 含水率下芝麻的熱傳導係數K值變化很小，因此採用平均值，作為模擬分析中的材料參數。

    數值分析方面，使用ANSYS有限元素軟體進行模擬分析，分別使用三種不同元素與運算方式來比對有無對流條件與不同流場流速下溫度場的差異。初步分析得到在僅有熱傳導效應下的爐體較有流場與對流效應的平均溫度高出約50℃ 且後者爐內溫差較小，表示熱對流效應對溫度場具有影響性。進一步的分析在討論填充芝麻後，不同流場流速下溫度場的差異，分析得到在紊流流場下其爐內溫差約2.6℃較層流流場的21℃要小，但在平均溫度上卻低了約20℃；由此可知流場流速對溫度分佈有正面影響，但會損失些許能量。
    The heat transfer modes consist of conduction, convection and radiation. Conduction and convection are the most important heat transfer modes within a rotary kiln. The heat transfer analysis considering only conduction, as former research of our project, is improved in this paper. The flow field, convection and conduction effects are considered and analyzed in this paper. This paper consists of the experimental and the numerical parts. In the experimental part, the KD-2 analyzer is used to measure the thermal conductivity of the sesame seeds with 12% moisture content. The thermal conductivity, 0.0604 W/m℃ is obtained for the numerical analysis. The software, ANSYS is chosen for numerical analysis. The simulation work is divided into two cases. It is found in the first case, by comparing the temperature fields between heat conduction only and flow field plus convection, the temperature distribution is quite different. The results from the second case, which is a comparison between different flow velocities in the rotary kiln, the temperature for turbulent flow is about 20℃ lower than for laminar flow. The temperature distribution for turbulent flow is more flat and is advantageous for our rotary kiln.
    显示于类别:[機械與機電工程學系暨研究所] 學位論文

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