本研究分為兩部份，第一部份為以化學還原法製備含有羥基包覆的奈米金 (AuMUD)，使其外層具有-OH官能基，然後將AuMUD以不同重量百分比例掺入環氧丙烯酸酯中，使-OH基與C=O形成氫鍵，製成薄膜及厚膜。第二部份的研究為利用化學還原法製備出由MPS包覆的奈米金粒子(AuMPS)，再與poly(MMA-co-MSMA)作鍵結，並加入適量的水催化水解縮合反應，合成出具有共價鍵結的聚甲基丙烯酸酯-奈米金奈米複合材料。研究中並探討奈米金粒徑大小與比例對聚甲基丙烯酸酯-奈米金複合材料各種性質之影響。 本研究的獨特點為利用高分子與奈米金間的化學鍵結，製備固態的高分子-奈米金奈米複合材料或薄膜，提升奈米金在奈米複合材料或薄膜中的含量，並討論奈米金對於高分子結構與性質的影響，以增進其應用範圍。在研究中發現在AuMUD/Epoxy Acrylate奈米複合薄膜中，奈米金含量0.01 wt%時可得到優良的奈米金在基材分散性、最高熱裂解溫度、良好的疏水性以及硬度。在AuMPS/MMS奈米複合薄膜中，奈米金含量0.1 wt% (Au : MPS = 1 : 5)時，具有良好的奈米金在基材中的分散性、最高熱裂解溫度、高折射率以及良好之硬度。 This research divides into two parts. The first part is the preparation of MUD coated nanogold (AuMUD) and its blend with epoxy acrylate. AuMUD have OH furetion groups on the particle surface. Thus, the hydrogen bond was formed with the C=O groups of epoxy acrylate. The second part is the preparation of MPS coated nanogold (AuMPS) and its nanocomposites with poly(MMA-co-MSMA). The covalent bond between AuMPS and the copolymer was formed by the hydrolysis and condensation reactions with suitable water as the catalyst. The effects of AuMPS size on the properties of the nanocomposites was also studied in this study. The unique of this study are the preparation of the solid polymer-nanogold nanocomposites and thin films by the chemical bonding between the polymers and nanogold in order to increase the contain of nanogold in the nanocomposite or thin film and the effects of nanogold on the structures and properties of the polymers in order to increase the application range. From the research results, the AuMUD/epoxy acrylate nanocomposite with 0.01 wt% nanogold has the best dispersion of the nanogold in the matrix, the highest thermal decomposition temperature, and better hydrophobic ability and hardness. The AuMPS/acrylic nanocomposite with 0.1 wt% nanogold(Au:MPS = 1:5) has the best dispersion of the nanogold in the matrix, the highest thermal decomposition temperature, and better hydrophobic ability and hardness.
