淡江大學機構典藏:Item 987654321/34856
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    題名: 改質奈米二氧化矽/高分子複合材料之製備與物性分析
    其他題名: Preparation and characterization of modified nano-silica/ polymer hybrid materials
    作者: 歐陽岱岳;Oyang, Tai-yueh
    貢獻者: 淡江大學化學工程與材料工程學系碩士班
    陳慶鐘
    關鍵詞: 奈米二氧化矽;奈米粒子表面改質;溶膠凝膠程序;有機無機混成;nano-silica;surface modified of nano-silica;ol-gel process;organic-inorganic hybrid
    日期: 2006
    上傳時間: 2010-01-11 05:41:38 (UTC+8)
    摘要: 本研究是經由溶膠凝膠製程，將四乙氧基矽烷(TEOS)先行水解、縮合反應成為二氧化矽，接著分別加入偶合劑三異丙基矽基丙烯酸酯(MSMA)、封頭劑三甲基乙氧基矽烷(TMES)對二氧化矽微粒進行表面改質；之後再將其導入反應性單體2-HEMA、交聯劑DPHA製作成混成塗料。
    在實驗中調整不同的封頭劑TMES添加量作分析，探討添加量對二氧化矽溶膠長期儲存穩定性的影響，並利用TEM觀察改質與未改質二氧化矽粒子大小，藉由粒徑分析得到其粒徑分布，而其化學分析部份，利用FTIR、固態29SiNMR檢測其化學結構。
    混成材料的性質分析方面，利用TGA、DSC、DMA進行熱性質分析，以得到無機物與封頭劑含量對混成材料的影響；最後並並測試混成塗膜之硬度、耐磨性、密著性等物理性質。
    實驗結果顯示，封頭劑TMES已成功的接上二氧化矽微粒的表面，並能減少粒子間的物理性聚集與化學反應，成功延長膠體的耐久性，粒子大小可以長時間維持在20nm以下；而混成材料的熱性質、物理性質都會因為二氧化矽的添加而有所提升，然而封頭劑的增加會使得機械性質稍微降低，但是整體效果與未添加二氧化矽相比較仍然顯著的提升。
    We used sol-gel process in this investigation. First, tetraethoxylsilane (TEOS) were formed colloidal silica by hydrolysis and condensation reaction. Second, colloidal silica was modified by adding couple agent 3-(trimethoxysilyl) propyl methacrylate (MSMA) and termination agent trimethyethoxylsilane (TMES) in order. Final, monomer 2-hydroxyethyl methacrylate (2-HEMA) and Dipentaerythritol hexaacrylate (DPHA) were added into the system forming hybrid material.
    We controlled the TMES contain to increase the storage time of silica sol and study their relation. The particle size of silica and modified silica were measured by TEM and light scatter. FTIR and solid – state 29SiNMR were employed to investigate the chemical bonds.
    TGA、DSC、DMA were employed to investigated the thermal property of effect of silica and TMES contain for hybrid material. In addition, the physical property of hardness、adhesion test and abrasion test were tested.
    In the results, TMES was successful reacted with silica. Physical aggregation or chemical reactions of the particles were avoided. The storage time of Silica sol were extended. The particle sizes were under 20 nm. Silica could improve the thermal property and physical property. TMES willed reduce physical property but was still better than polymer material.
    顯示於類別:[化學工程與材料工程學系暨研究所] 學位論文

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