English  |  正體中文  |  简体中文  |  Items with full text/Total items : 49064/83169 (59%)
Visitors : 6956862      Online Users : 62
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library & TKU Library IR team.
Scope Tips:
  • please add "double quotation mark" for query phrases to get precise results
  • please goto advance search for comprehansive author search
  • Adv. Search
    HomeLoginUploadHelpAboutAdminister Goto mobile version
    Please use this identifier to cite or link to this item: http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/27751


    Title: Comparison of electronic structures of RuO2 and IrO2 nanorods investigated by x-ray absorption and scanning photoelectron microscopy
    Authors: Tsai, H. M.;Babu, P. D.;Pao, C. W.;Chiou, J. W.;Jan, J. C.;Krishna Kumar, K. P.;錢凡之;Chien, F. Z.;彭維鋒;Pong, Way-faung;Tsai, M. H.;Chen, Chih-Hao;Jang, L. Y.;Lee, J. F.;Chen, R. S.;Huang, Y. S.;Tsai, D. S.
    Contributors: 淡江大學物理學系
    Date: 2007-01-22
    Issue Date: 2009-12-31 10:41:52 (UTC+8)
    Publisher: American Institute of Physics (AIP)
    Abstract: Through-wafer interconnects by aligned carbon nanotube for three-dimensional stack integrated chip packaging applications have been reported in this letter. Two silicon wafers are bonded together by tetra-ethyl-ortho-silicate. The top wafer (100 μm thick) with patterned through-holes allows carbon nanotubes to grow vertically from the catalyst layer (Fe) on the bottom wafer. By using thermal chemical vapor deposition technique, the authors have demonstrated the capability of growing aligned carbon nanotube bundles with an average length of 140 μm and a diameter of 30 μm from the through holes. The resistivity of the bundles is measured to be 0.0097 cm by using a nanomanipulator. © 2007 American Institute of Physics.
    Relation: Applied Physics Letters 91(4), pp.042108
    DOI: 10.1063/1.2759989
    Appears in Collections:[物理學系暨研究所] 期刊論文

    Files in This Item:

    File Description SizeFormat
    0003-6951_91(4)p042108.pdf288KbAdobe PDF763View/Open

    All items in 機構典藏 are protected by copyright, with all rights reserved.


    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library & TKU Library IR teams. Copyright ©   - Feedback