臺灣半導體產業垂直分工模式--晶圓代工為IC設計業成本最大宗 佔總成本一半以上

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Title:	臺灣半導體產業垂直分工模式--晶圓代工為IC設計業成本最大宗佔總成本一半以上
Authors:	聶建中;Nieh, Chien-chung
Contributors:	淡江大學財務金融學系
Date:	2003-06-09
Issue Date:	2009-11-30 17:47:23 (UTC+8)
Publisher:	理財周刊股份有限公司
Relation:	理財周刊(Wealth Management Weekly) 145，頁 13
Appears in Collections:	[Graduate Institute & Department of Banking and Finance] Journal Article

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