English  |  正體中文  |  简体中文  |  Items with full text/Total items : 51258/86283 (59%)
Visitors : 8023747      Online Users : 53
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library & TKU Library IR team.
Scope Tips:
  • please add "double quotation mark" for query phrases to get precise results
  • please goto advance search for comprehansive author search
  • Adv. Search
    HomeLoginUploadHelpAboutAdminister Goto mobile version
    Please use this identifier to cite or link to this item: http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/18837


    Title: 陰離子型水性PU分散液之架橋反應
    Authors: 陳幹男;楊正平
    Contributors: 淡江大學化學學系
    Keywords: PU分散液;熱硬化;光硬化;架橋反應(交聯反應);Pu Dispersion;Thermal-Curing;Photo-Curing;Cross-Linking Reaction
    Date: 1989-06-22
    Issue Date: 2009-09-21 18:42:46 (UTC+8)
    Publisher: 清華大學化學工程研究所; 行政院國家科學委員會工程科技推展中心; 中國化學工程學會
    Abstract: 本報告以NCO為末端基之PU預聚合物分 散於水相的同時進行架橋反應,具有胺基的化 合物如部分甲醇化之三聚氰胺,三乙烯四胺,尿 素及乙烯二胺均可進行架橋反應,另外以硬化行型的架橋劑TMPTA加入已被熱硬化的PU分散 液中,再進行紫外光架橋反應,發現機械性質, 物理性質及耐水性等均有明顯的改進。
    A cross-linking reaction was introduced between PU prepolymer and amino curing agent while NCO-terminated PU prepolymers were dispersed into water phase. Triethylenetetraamine (TETA), ethylene diamine (EDA), partially methylolated melamine and urea among those amino group containing curing agents were used, and formaldehyde was applied for further cross-linking of those amino-cured PU dispersions via a thermal curing reaction; moreover, a photo-curing reaction was induced into one of those thermally cured PU dispersions and TMPTA was a cross-linker. The tensile strength, elongation, hardness as well as water resistance of the cured PU films had large improvements.
    Relation: 第十二屆高分子研討會論文專輯第五卷=Proceedings of the 12th R.O.C. Polymer Symposium 1989,頁 242-245
    Appears in Collections:[化學學系暨研究所] 會議論文

    Files in This Item:

    File Description SizeFormat
    陰離子型水性PU分散液之架橋反應_英文摘要.docx摘要18KbMicrosoft Word75View/Open
    陰離子型水性PU分散液之架橋反應_中文摘要.docx摘要16KbMicrosoft Word116View/Open

    All items in 機構典藏 are protected by copyright, with all rights reserved.


    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library & TKU Library IR teams. Copyright ©   - Feedback