The increasing power density of high-performance electronic devices poses significant thermal management challenges. Vapor chambers (VCs) offer efficient heat dissipation, but traditional manufacturing methods limit their structural precision and performance. This study investigates the thermal performance of VCs fabricated with additive manufacturing (AM), featuring triply periodic minimal surface (TPMS) Gyroid capillary structures at two fill ratios under varying thermal loads. Enhanced thermal
stability and performance were observed in the higher fill ratio, particularly under higher heat loads, whereas the lower fill ratio excelled under low-heat conditions, achieving a thermal resistance as low as 0.3688 K/W at an 80Wheat load. Additionally, the research
explored the advantages and challenges of horizontal and vertical printing techniques in VC fabrication. Horizontal printing was found to compromise cavity volume due to necessary support structures, whereas vertical printing enhanced mass production feasibility and maintained effective vapor circulation. This study proposes a novel approach using AM to manufacture VCs as a monolithic structure. By eliminating the need for welding, this method ensures seamless integration of the capillary structure with the housing, thereby
avoiding issues related to poor contact or welding-induced damage. The study confirmed a 75% reduction in thermal resistance in VCs with capillary structures compared to those without under similar conditions, highlighting the significant potential of integrating precisely designed capillary structures and additive manufacturing in improving vapor
chamber performance for advanced thermal management applications.
