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    Please use this identifier to cite or link to this item: https://tkuir.lib.tku.edu.tw/dspace/handle/987654321/126348


    Title: 低溫SnIn銲料界面接合反應之介金屬微結構研究
    Authors: 林能安;林湘庭;王儀雯
    Keywords: 淨零碳排;ENIG基板;Sn52In銲料;微結構觀察;介金屬
    Date: 2024-06-28
    Issue Date: 2024-10-02 12:07:23 (UTC+8)
    Appears in Collections:[化學工程與材料工程學系暨研究所] 會議論文

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