淡江大學機構典藏:Item 987654321/126347
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    Please use this identifier to cite or link to this item: https://tkuir.lib.tku.edu.tw/dspace/handle/987654321/126347


    Title: Adding Au and In to SnBi Solder on the Effectiveness of Inhibiting Bi Segregation
    Authors: Fang, C.C.;Wang, Y.W.
    Keywords: Microstructure;Mechanical properties;SnBiAu;SnBiIn;Bi Segregation
    Date: 2023-11-17
    Issue Date: 2024-10-02 12:07:20 (UTC+8)
    Appears in Collections:[Graduate Institute & Department of Chemical and Materials Engineering] Proceeding

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